However, the ideal matching and isolation between two outputs are not taken into consideration. To tackle this thorny issue, another unique type of baluns based on vertically mounted planer (VMP) structures is reported. Nevertheless, the DSPSL in the bottom layer complicates the fabrication when suspended in metallic shields for high-power push–pull amplifiers. No wonder, due to the inherent out-of-phase frequency independence, double-sided parallel-strip line (DSPSL) has attracted growing attention on investigating balun.
To accommodate to this trend, much effort has been made on the exploration of highly integrated multi-standard balun. Nowadays, increasing demands have been put forward for advanced multi-band and wideband modern wireless communication systems.
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